The product's shade and actual color may differ from what is shown in the picture, as the images are for illustrative purposes. The product description is general and may not include all the product's features.
GENESIS Silicon 900 heat sink compound Thermal paste 12.8 W/m·K 2 g
67,42 €
Monthly payment from 2.64 €
3623477 NTG-2328
5901969449457
Shipping 5-6 b.d.
Pay 5x13.48€You are interested in this product?
Meet GENESIS Silicon 900 - a high-performance thermal conductive paste that will help you win the unequal battle against temperatures. Optimal density and good thermal conductivity properties are not enough. In the kit you will find a moistened cloth and spatula for easy application.
EFFECTIVE FIGHT AGAINST TEMPERATURES
Low component temperatures? From today you can achieve them with GENESIS Silicon 900 - an easy-to-apply thermal conductive paste distinguished by high thermal conductivity (12.8 w/-K). You do not need to heat it up, you will gain optimal thermal conductivity values from the first seconds after application. What's more, GENESIS paste is distinguished by its safe formula, which means no conductivity and resistance to corrosion.
SIMPLE APPLICATION
Applying GENESIS Silicon 900 is easy not only because of its optimal formula (2.8 g/cm3). This is also due to the included spatula and a moistened cloth, which will allow you to get rid of residual dirt. This makes the application manageable even for the least experienced users.
UNIVERSAL APPLICATION
GENESIS Silicon 900 is great for desktop computers, laptops and consoles. It will keep your performance high and temperatures low during both work and long gaming sessions.
Performance | |
| Operating temperature (T-T) | -50 - 250 °C |
| Type | Thermal paste |
| Quantity per pack | 1 pc(s) |
| Thermal conductivity | 12.8 W/m·K |
Weight & dimensions | |
| Weight | 2 g |
30 other products in the same category:
